CYRF89435_13 Datasheet, PDF (32/39 Pages) Cypress Semiconductor – PRoC™ - CapSense®

CYRF89435
Packaging Information
This section illustrates the packaging specifications for the CY7C89435 PSoC device, along with the thermal impedances for each
package.
Important Note
Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the emulation tools’
dimensions, refer to the document titled PSoC Emulator Pod Dimensions at http://www.cypress.com/design/MR10161.
Figure 14. 40-pin QFN (6 × 6 × 1.0 mm) LT40B 3.5 × 3.5 mm E-Pad (Sawn) Package Outline, 001-13190
001-13190 *H
Important Notes
■ For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
■ Pinned vias for thermal conduction are not required for the low power PSoC device.
Document Number: 001-76581 Rev. *E
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