CYII5FM1300AB Datasheet, PDF (30/40 Pages) Cypress Semiconductor – 1.3 MP CMOS Image Sensor

IBIS5-B-1300 CYII5FM1300AB
Pad position and Packaging
Bare Die
The IBIS5-B-1300 image sensor has 84 pins, 21 pins on every edge. The die size from pad-edge to pad-edge (without scribe-line) is:
10156.5 µm (x) by 9297.25 µm (y). Scribe lines take about 100 to 150 µm extra on each side. Pin 1 is located in the middle of the left
side, indicated by a ‘1’ on the layout. A logo and some identification tags are on the top right of the die.
Figure 30. IBIS5-B-1300 Bare Die Dimensions (All dimensions in µm)
Test structure
Identification
Document #: 38-05710 Rev. *C
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