CY2037_09 Datasheet, PDF (3/11 Pages) Cypress Semiconductor – High-Accuracy EPROM Programmable PLL Die for Crystal Oscillators

CY2037
Die Pad Description
Horizontal scribe
VDD
VDD
XX
XD
Y
N/C
XR
XG
PD#/OE or FS
CLKOUT
N/C
VSS
VSS
Note
Active die size: X = 55.9 mils / 1420.1 μm
Vertical scribe
Device Name
Scribe: X (horizontal) = 2.6 mils / 65.6 μm
Y (vertical) = 3.0 mils / 76.9 μm
Bond pad opening: 85 μm x 85 μm
Pad pitch: 125 μm x 125 μm
(pad center to pad center)
X
Die Pad Summary
Name
V_DD
V_SS
X_D
X_X
X_G
PD#/OE
or FS
Die
Pad
1, 2
8, 9
4
3
6
7
CLKOUT 11
N/C
5, 10
X Coordinate
(μm)
124.7
1291.35
124.7
124.7
124.7
124.7
1282.45
124.7,1282.45
Y Coordinate
(μm)
855.6, 731
99.6, 225.2
481.8
606.4
232.6
108
901.8
357.2, 769.4
Description
Voltage supply
Ground
Crystal connection
No connect ^[2]
Crystal connection
CY2037A, CY2037B, and CY2037-2: EPROM-programmable power down
or output enable pad
CY2037-3: Frequency select. Serves as V_PP in programming mode for all
devices
Clock output. Also serves as three-state input during programming.
No connect (so do not bond to these pads)
Note
2. For customers not bonding the X_D or X_G pad to external pins, an alternative bonding option would be shorting the Xx pad to the X_D pad.
Document Number: 38-07354 Rev. *E
Page 3 of 11
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