CY8CMBR2010_12 Datasheet, PDF (27/31 Pages) Cypress Semiconductor – CapSense® Express™ 10-Button Controller

CY8CMBR2010
Package Information
Thermal Impedance
Table 19. Thermal Impedances per Package
Package
32-pin QFN^[9]
Typical θ_JA^[8]
20 °C/W
Solder Reflow Specifications
Table 20 shows the solder reflow temperature limits that must not be exceeded.
Table 20. Solder Reflow Specifications
Package
32-pin QFN
Minimum Peak Temperature
(T_C)
260 C
Maximum Time above
T_C – 5 °C
30 seconds
Package Diagram
Figure 26. 32-pin QFN (5 × 5 × 0.55 mm) LQ32 3.5 × 3.5 E-Pad (Sawn) Package Outline, 001-42168
001-42168 *D
Notes
8. T_J = T_A + Power × _JA.
9. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
Document Number: 001-74495 Rev. *A
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