CY7C60445_0810 Datasheet, PDF (24/28 Pages) Cypress Semiconductor – enCoRe™ V Low Voltage Microcontroller

CY7C60445, CY7C6045x
Package Diagram
This chapter illustrates the packaging specifications for the enCoRe V LV device, along with the thermal impedances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the enCoRe V LV emulation tools and their dimensions, refer to the development kit..
Packaging Dimensions
Figure 8. 32-Pin (5 x 5 x 0.55 mm) QFN
001-42168 *B
Document Number: 001-12395 Rev. *G
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