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CY7C1566KV18 Datasheet, PDF (21/28 Pages) Cypress Semiconductor – 72-Mbit DDR-II+ SRAM 2-Word Burst Architecture
PRELIMINARY
CY7C1566KV18, CY7C1577KV18
CY7C1568KV18, CY7C1570KV18
Electrical Characteristics (continued)
DC Electrical Characteristics
Over the Operating Range [13]
Parameter
Description
Test Conditions
Min
Typ
Max
Unit
ISB1
Automatic Power down
Max VDD,
550 MHz (x8)
Current
Both Ports Deselected,
VIN ≥ VIH or VIN ≤ VIL
f = fMAX = 1/tCYC,
(x9)
(x18)
Inputs Static
(x36)
380
mA
380
380
380
500 MHz (x8)
360
mA
(x9)
360
(x18)
360
(x36)
360
450 MHz (x8)
340
mA
(x9)
340
(x18)
340
(x36)
340
400 MHz (x8)
320
mA
(x9)
320
(x18)
320
(x36)
320
AC Electrical Characteristics
Over the Operating Range [12]
Parameter
Description
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
Test Conditions
Min
VREF + 0.2
–0.24
Typ
Max
Unit
– VDDQ + 0.24 V
–
VREF – 0.2
V
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
CIN
Input Capacitance
CO
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz, VDD = 1.8V, VDDQ = 1.5V
Max
Unit
2
pF
3
pF
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
ΘJA Thermal Resistance
(Junction to Ambient)
ΘJC Thermal Resistance
(Junction to Case)
Test Conditions
Test conditions follow standard test methods and procedures
for measuring thermal impedance, in accordance with
EIA/JESD51.
165 FBGA
Package
13.7
3.73
Unit
°C/W
°C/W
Document Number: 001-15880 Rev. *D
Page 21 of 28
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