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CY7C1522JV18 Datasheet, PDF (21/27 Pages) Cypress Semiconductor – 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1522JV18, CY7C1529JV18
CY7C1523JV18, CY7C1524JV18
Electrical Characteristics (continued)
DC Electrical Characteristics
Over the Operating Range [12]
Parameter
Description
Test Conditions
Min
Typ
Max
Unit
ISB1
Automatic Power Down
Max VDD,
300 MHz (x8)
Current
Both Ports Deselected,
VIN ≥ VIH or VIN ≤ VIL
(x9)
f = fMAX = 1/tCYC,
(x18)
Inputs Static
(x36)
400
mA
400
400
400
250 MHz (x8)
380
mA
(x9)
380
(x18)
380
(x36)
380
AC Electrical Characteristics
Over the Operating Range [11]
Parameter
Description
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
Test Conditions
Min
Typ
VREF + 0.2
–
–
–
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
Test Conditions
Max
CIN
Input Capacitance
TA = 25°C, f = 1 MHz, VDD = 1.8V, VDDQ =
5.5
CCLK
Clock Input Capacitance 1.5V
8.5
CO
Output Capacitance
6
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
ΘJA
Thermal Resistance
(Junction to Ambient)
ΘJC Thermal Resistance
(Junction to Case)
Test Conditions
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, in accordance with
EIA/JESD51.
165 FBGA
Package
16.3
2.1
Max
–
VREF – 0.2
Unit
V
V
Unit
pF
pF
pF
Unit
°C/W
°C/W
Document #: 001-44700 Rev. *B
Page 21 of 27
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