FM25V20 Datasheet, PDF (14/17 Pages) Ramtron International Corporation – 2Mb Serial 3V F-RAM Memory

Mechanical Drawing
8-pin TDFN* (5.0 mm x 6.0 mm body, 1.27 mm pad pitch)
5.0 BSC
FM25V20 – 2Mb SPI F-RAM
Exposed metal pad
should be left floating.
Pin 1 ID
Pin 1
0.75 ±0.05
1.27
0.40 ±0.05
0.0 - 0.05
3.81 REF
0.60 ±0.05
0.20 REF.
Recommended PCB Footprint
1.4
6.80
Silkscreen
Pin 1
1.27
0.60
Note: All dimensions in millimeters. This package is footprint compatible with the 8-pin SOIC.
The exposed pad should be left floating.
TDFN Package Marking Scheme for Body Size 5.0mm x 6.0mm
RGXXXXT
LLLL
YYWW
Legend:
R=Ramtron, G=”green” TDFN package
XXXX=base part number, T=temperature (blank=ind., C=comm.)
LLLL= lot code
YY=year, WW=work week
Example: “Green” TDFN package, FM25V20, Lot 0012, Year 2010, Work Week 29
RG5V20
0012
1029
Rev. 3.0
August 2012
Page 14 of 17