CY62187EV30_11 Datasheet, PDF (13/14 Pages) Cypress Semiconductor – 64-Mbit (4 M × 16) Static RAM

CY62187EV30 MoBL^®
Document History Page
Document Title: CY62187EV30 MoBL^® 64-Mbit (4 M × 16) Static RAM
Document Number: 001-48998
Revision ECN
Orig. of Submission
Change
Date
Description of Change
**
2595932 VKN/PYRS 10/24/08 New Datasheet
*A
2644442 VKN/PYRS 01/23/09 Updated the Package diagram on page 10
*B
2672650 VKN/PYRS 03/12/09 Extended the V_CC range to 3.7V
Added 55 ns speed bin and it’s related information
Changed I_{CC (typ)} from 2.5 mA to 3.5 mA at f = 1 MHz
Changed I_{CC (max)} from 4 mA to 6 mA at f = 1 MHz
For 70 ns speed, changed I_{CC (typ)} form 33 mA to 28 mA at f = f_MAX
For 70 ns speed, changed I_{CC (max)} from 40 mA to 45 mA at f = f_MAX
For 70 ns speed, changed t_PWE from 45 to 50 ns, t_SD from 30 to 35 ns
Modified footnote #6
Changed 48-Ball FBGA package dimensions from 8 x 9.5 x 1.6 mm to
8 x 9.5 x 1.4 mm and updated package diagram on page 10
*C
2737164 VKN/AESA 07/13/09 Converted from preliminary to final
Changed I_CC(typ) from 3.5 mA to 4 mA at f = 1 MHz
Changed I_CC(typ) from 35 mA to 45 mA and from 28 mA to 35 mA for the speeds
50 ns and 70 ns respectively at f = f_max
Included V_CC range in the test condition of the “Electrical Characteristics” table
for the specs V_OH, V_OL, V_IH, V_IL
Changed V_IL(max) from 0.8V to 0.7V for V_CC = 2.7V to 3.7V
Changed C_IN spec from 20 pF to 25 pF and C_OUT spec from 20 pF to 35 pF
Included thermal specs for 48-FBGA
Included V_CC range for V_TH spec in the AC test load table
Changed t_LZBE spec from 5 ns to 10 ns
Added footnote #20 related to chip enable
*D
2765892
VKN
*E
3177000
AJU
09/18/09
02/18/2011
Removed 70 ns speed
For 55 ns speed, at f = 1 MHz, changed I_{CC (max)} spec from 6 mA to 9 mA
Changed I_CC(typ) from 4 mA to 7.5 mA at f = 1 MHz
Updated Features (Corrected I_CC(typ) from 4 mA to 7.5 mA).
Updated Pin Configuration (Renamed Figure 1 as “48-ball FBGA”).
Updated Product Portfolio (Corrected I_CC(typ) from 4 mA to 7.5 mA).
Updated Electrical Characteristics (Included BHE and BLE in I_SB2 test
conditions to reflect Byte power down feature).
Updated Table 1 on page 5 (AC Test Loads).
Updated Data Retention Characteristics (Included BHE and BLE in I_CCDR test
conditions to reflect Byte power down feature, corrected t_R(min) from t_RC to
55 ns).
Added Ordering Code Definitions.
Updated Package Diagram.
Added Acronyms and Units of Measure.
Changed all instances of IO to I/O.
Updated in new template.
Document Number: 001-48998 Rev. *E
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