CY2305_08 Datasheet, PDF (12/15 Pages) Cypress Semiconductor – Low-Cost 3.3V Zero Delay Buffer

CY2305
CY2309
Package Drawing and Dimensions
8 Lead (150 Mil) SO_FI_iC_gu-_rS_e0₈8_{. 8-Pin (150-Mil) SOIC S8}
PIN 1 ID
4
1
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
3. REFERENCE JEDEC MS-012
4. PACKAGE WEIGHT 0.07gms
5
8
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
0.189[4.800]
0.196[4.978]
SEATING PLANE
0.010[0.254] _{X 45°}
0.016[0.406]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.004[0.102]
0°~8°
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
51-85066-*C
16 Lead (150 Mil) SOIC
8
Figure 9. 16-Pin (150-Mil) SOIC S16
PIN 1 ID
1
DIMENSIONS IN INCHES[MM] MIN.
REFERENCE JEDEC MS-012
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
PACKAGE WEIGHT 0.15gms
PART #
S16.15 STANDARD PKG.
9
16
SZ16.15 LEAD FREE PKG.
MAX.
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.0138[0.350]
0.0192[0.487]
SEATING PLANE
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.004[0.102]
0.0098[0.249]
0° ~8°
0.010[0.254] _{X 45°}
0.016[0.406]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
51-85068-*B
Document #: 38-07140 Rev. *I
Page 12 of 15
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