English
Language : 

CY7C1021BV33 Datasheet, PDF (1/11 Pages) Cypress Semiconductor – 64K x 16 Static RAM
021B V33
CY7C1021BV33
Features
• 3.3V operation (3.0V–3.6V)
• High speed
— tAA = 10/12/15 ns
• CMOS for optimum speed/power
• Low Active Power (L version)
— 576 mW (max.)
• Low CMOS Standby Power (L version)
— 1.80 mW (max.)
• Automatic power-down when deselected
• Independent control of upper and lower bits
• Available in 44-pin TSOP II and 400-mil SOJ
• Available in a 48-Ball Mini BGA package
Functional Description[1]
The CY7C1021BV is a high-performance CMOS static RAM
organized as 65,536 words by 16 bits. This device has an au-
tomatic power-down feature that significantly reduces power
consumption when deselected.
Logic Block Diagram
DATA IN DRIVERS
A7
A6
A5
64K x 16
A4
RAM Array
A3
512 X 2048
A2
A1
A0
COLUMN DECODER
64K x 16 Static RAM
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is
written into the location specified on the address pins (A0
through A15). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O9 through I/O16) is written into the location
specified on the address pins (A0 through A15).
Reading from the device is accomplished by taking Chip En-
able (CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then
data from the memory location specified by the address pins
will appear on I/O1 to I/O8. If Byte High Enable (BHE) is LOW,
then data from memory will appear on I/O9 to I/O16. See the
truth table at the back of this data sheet for a complete descrip-
tion of read and write modes.
The input/output pins (I/O1 through I/O16) are placed in a
high-impedance state when the device is deselected
(CE HIGH), the outputs are disabled (OE HIGH), the BHE and
BLE are disabled (BHE, BLE HIGH), or during a write opera-
tion (CE LOW, and WE LOW).
The CY7C1021BV is available in 400-mil-wide SOJ, standard
44-pin TSOP Type II, and 48-ball mini BGA packages.
I/O1–I/O8
I/O9–I/O16
BHE
WE
CE
OE
BLE
Pin Configurations
SOJ / TSOP II
Top View
A4 1
A3 2
A2 3
A1 4
A0 5
CE 6
I/O1 7
I/O2 8
I/O3 9
I/O4 10
VCC 11
VSS 12
I/O5 13
I/O6 14
I/O7 15
I/O8 16
WE 17
A15 18
A14 19
A13 20
A12 21
NC 22
44 A5
43 A6
42 A7
41 OE
40 BHE
39 BLE
38 I/O16
37 I/O15
36 I/O14
35 I/O13
34 VSS
33 VCC
32 I/O12
31 I/O11
30 I/O10
29 I/O9
28 NC
27 A8
26 A9
25 A10
24 A11
23 NC
Selection Guide
7C1021BV-8 7C1021BV-10 7C1021BV-12 7C1021BV-15
Maximum Access Time (ns)
8
10
12
15
Maximum Operating Current (mA) Commercial
170
160
150
140
Industrial
190
180
170
160
Maximum CMOS Standby Current Commercial
5
(mA)
L
0.500
5
0.500
5
0.500
5
0.500
Shaded areas contain advance information.
Note:
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.
Cypress Semiconductor Corporation • 3901 North First Street • San Jose • CA 95134 • 408-943-2600
Document #: 38-05148 Rev. *A
Revised September 13, 2002