CY62167DV30LL-55BVXIT Datasheet, PDF (1/17 Pages) Cypress Semiconductor – 16-Mbit (1 M × 16) Static RAM

CY62167DV30 MoBL^®
16-Mbit (1 M × 16) Static RAM
Features
■ Thin small outline package (TSOP-I) configurable as
1 M × 16 or as 2 M × 8 SRAM
■ Wide voltage range: 2.2 V – 3.6 V
■ Ultra-low active power: Typical active current:
2 mA at f = 1 MHz
■ Ultra-low standby power
■ Easy memory expansion with CE₁, CE₂ and OE features
■ Automatic power-down when deselected
■ Complementary metal oxide semiconductor (CMOS) for
optimum speed / power
■ Available in Pb-free and non Pb-free 48-ball very fine-pitch
ball grid array (VFBGA) and 48-pin TSOP I package
Functional Description
The CY62167DV30 is a high-performance CMOS static RAM
organized as 1M words by 16-bits. This device features
advanced circuit design to provide ultra-low active current.
This is ideal for providing More Battery Life™ (MoBL^®) in
portable applications such as cellular telephones. The device
Logic Block Diagram
A₁₀
A₉
A₈
A₇
A₆
A₅
A₄
A₃
A₂
A
A
1
0
DATA IN DRIVERS
1M × 16 / 2M x 8
RAM Array
also has an automatic power-down feature that significantly
reduces power consumption by 99% when addresses are not
toggling. The device can also be put into standby mode when
deselected (CE₁ HIGH or CE₂ LOW or both BHE and BLE are
HIGH). The input/output pins (I/O₀ through I/O₁₅) are placed
in a high-impedance state when: deselected (CE₁ HIGH or
CE₂ LOW), outputs are disabled (OE HIGH), both Byte High
Enable and Byte Low Enable are disabled (BHE, BLE HIGH),
or during a Write operation (CE₁ LOW, CE₂ HIGH and WE
LOW).
Writing to the device is accomplished by taking Chip Enables
(CE₁ LOW and CE₂ HIGH) and Write Enable (WE) input LOW.
If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O₀
through I/O₇), is written into the location specified on the
address pins (A₀ through A₁₉). If Byte High Enable (BHE) is
LOW, then data from I/O pins (I/O₈ through I/O₁₅) is written into
the location specified on the address pins (A₀ through A₁₉).
Reading from the device is accomplished by taking Chip
Enables (CE₁ LOW and CE₂ HIGH) and Output Enable (OE)
LOW while forcing the Write Enable (WE) HIGH. If Byte Low
Enable (BLE) is LOW, then data from the memory location
specified by the address pins appear on I/O₀ to I/O₇. If Byte
High Enable (BHE) is LOW, then data from memory appear on
I/O₈ to I/O₁₅. See the truth table at the back of this data sheet
for a complete description of Read and Write modes.
I/O₀–I/O₇
I/O₈–I/O₁₅
COLUMN DECODER
Power-Down
Circuit
BHE
BLE
BYTE
BHE
WE
CE₂
CE₁
OE
BLE
CE₂
CE₁
Cypress Semiconductor Corporation • 198 Champion Court
Document Number : 38-05328 Rev. *J
• San Jose, CA 95134-1709 • 408-943-2600
Revised July 27, 2011