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CY62147EV30_09 Datasheet, PDF (1/13 Pages) Cypress Semiconductor – 4-Mbit (256K x 16) Static RAM
CY62147EV30 MoBL®
4-Mbit (256K x 16) Static RAM
Features
■ Very high speed: 45 ns
■ Temperature ranges
❐ Industrial: –40°C to +85°C
❐ Automotive-A: –40°C to +85°C
❐ Automotive-E: –40°C to +125°C
■ Wide voltage range: 2.20V to 3.60V
■ Pin compatible with CY62147DV30
■ Ultra low standby power
❐ Typical standby current: 1 μA
❐ Maximum standby current: 7 μA (Industrial)
■ Ultra low active power
❐ Typical active current: 2 mA at f = 1 MHz
■ Easy memory expansion with CE [1] and OE features
■ Automatic power down when deselected
■ CMOS for optimum speed and power
■ Available in Pb-free 48-ball VFBGA (single/dual CE option) and
44-pin TSOPII packages
■ Byte power down feature
Functional Description
The CY62147EV30 is a high performance CMOS static RAM
organized as 256K words by 16 bits. This device features
advanced circuit design to provide ultra low active current. It is
ideal for providing More Battery Life™ (MoBL®) in portable appli-
cations such as cellular telephones. The device also has an
automatic power down feature that significantly reduces power
consumption when addresses are not toggling. Placing the
device into standby mode reduces power consumption by more
than 99% when deselected (CE HIGH or both BLE and BHE are
HIGH). The input and output pins (IO0 through IO15) are placed
in a high impedance state when:
■ Deselected (CE HIGH)
■ Outputs are disabled (OE HIGH)
■ Both Byte High Enable and Byte Low Enable are disabled
(BHE, BLE HIGH)
■ Write operation is active (CE LOW and WE LOW)
To write to the device, take Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from IO pins (IO0 through IO7) is written into the location
specified on the address pins (A0 through A17). If Byte High
Enable (BHE) is LOW, then data from IO pins (IO8 through IO15)
is written into the location specified on the address pins (A0
through A17).
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appear on IO0 to IO7. If
Byte High Enable (BHE) is LOW, then data from memory
appears on IO8 to IO15. See the Truth Table on page 9 for a
complete description of read and write modes.
For best practice recommendations, refer to the Cypress
application note AN1064, SRAM System Guidelines.
Logic Block Diagram
POWER DOWN
CIRCUIT
DATA IN DRIVERS
A10
A9
A8
A7
A6
256K x 16
A5
A4
RAM Array
A3
A2
A1
A0
COLUMN DECODER
CE
BHE
BLE
IO0–IO7
IO8–IO15
BHE
WE
CE [1]
OE
BLE
Note
1. BGA packaged device is offered in single CE and dual CE options. In this data sheet, for a dual CE device, CE refers to the internal logical combination of CE1 and
CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. For all other cases CE is HIGH.
Cypress Semiconductor Corporation • 198 Champion Court
Document #: 38-05440 Rev. *G
• San Jose, CA 95134-1709 • 408-943-2600
Revised March 31, 2009
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