PRD25 Datasheet, PDF (4/13 Pages) CUI INC – DC-DC CONVERTER

For more information, please visit the product page.
CUI Inc │ SERIES: PRD25 │ DESCRIPTION: DC-DC CONVERTER
date 05/20/2016 │ page 4 of 13
SOLDERABILITY
parameter
wave soldering
reflow soldering
MECHANICAL
parameter
dimensions
weight
conditions/description
min
typ
for Sn/Ag/Cu based solders (for through hole
models):
preheat temperature
solder pot temperature
solder dwell time
reflow solder profile below is suitable for SAC305
type lead-free solders (for surface mount models)
245
260
optimal peak 245 ˚C, max peak 260 ˚C
240
SAC305 liquidus at 219 °C
220
ramp at 1 °C/second across liquidus
TAL at 60 seconds (range 45-75 seconds)
180
160
140
120
100
80
60
40
adjusktereapmrpamfopr
soak
rates
iuf _{nrdeeqrui2re°dC/second}
cooling rate 2-3 °C/second
20
0
1
2
3
4
5
6
7
Time (minutes)
max
115
270
7
260
units
°C
°C
s
°C
conditions/description
min
through hole: 1.10 x 0.96 x 0.33 [27.9 x 24.4 x 8.4 mm]
surface mount: 1.10 x 0.96 x 0.33 [27.9 x 24.4 x 8.4 mm]
typ
9.07
max
units
inches
inches
g
cui.com