HSS-C2591-SMT-TR Datasheet, PDF (1/3 Pages) CUI INC – low profile design

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MODEL: HSS-C2591-SMT-TR │ DESCRIPTION: HEAT SINK
FEATURES
• TO-263 package
• low profile design
• surface mount
• tape and reel pack
date 04/03/2017
page 1 of 3
MODEL
HSS-C2591-SMT-TR
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
35.71
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
40.16
@ 1 W,
200 LFM
(°C/W)
8.15
@ 1 W,
400 LFM
(°C/W)
6.53
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
2.10
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0
0
0
0
1
40.16
8.15
6.53
2
72.83
16.45
13.07
3
101.82
24.62
19.46
4
126.09
32.75
26.41
5
142.01
41.12
32.82
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
50
40
30
20
10
0
0
1
2
3
4
5
Dissipated Power (W)
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