HSS-B20-NP-13 Datasheet, PDF (1/3 Pages) CUI INC – round hole for component attachment

For more information, please visit the product page.
MODEL: HSS-B20-NP-13 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• round hole for component attachment
• low profile design
• black anodized finish
date 03/30/2017
page 1 of 3
MODEL
HSS-B20-NP-13
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
19.22
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
24.62
@ 1 W,
200 LFM
(°C/W)
5.88
@ 1 W,
400 LFM
(°C/W)
4.58
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
3.90
Power
(W)
0
1
2
3
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Natural
Conv.
200 LFM 400 LFM
0
0
0
24.62
5.88
4.58
43.44
11.42
9.32
59.88
17.13
13.74
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
50
40
4
76.23
22.27
18.34
30
5
89.60
27.80
22.64
20
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
10
0
0
1
2
3
4
5
Heat Dissipated (W)
cui.com