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HSS-B20-NP-12 Datasheet, PDF (1/3 Pages) CUI INC – two hole options for longer components pins
For more information, please visit the product page.
MODEL: HSS-B20-NP-12 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• round hole for component attachment
• two hole options for longer components pins
• black anodized finish
date 04/03/2017
page 1 of 3
MODEL
HSS-B20-NP-12
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
11.03
thermal resistance1
@ 1 W,
nat conv
(°C/W)
14.33
@ 1 W,
200 LFM
(°C/W)
3.47
@ 1 W,
400 LFM
(°C/W)
2.42
power
dissipation1
@ 75°C ΔT,
nat conv
(W)
6.80
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0
0
0
0
1
14.33
3.47
2.42
2
26.13
7.20
4.89
3
37.06
11.03
7.60
4
47.31
14.48
10.02
5
58.11
18.05
12.62
6
68.23
21.56
15.13
7
77.41
25.39
17.88
8
84.32
29.25
20.46
9
90.32
32.97
23.03
10
95.09
37.42
26.04
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
50
40
30
20
10
0
0
1
2
3
4
5
6
7
8
9
10
Dissipated Power ( W )
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