HSS-B20-NP-04 Datasheet, PDF (1/3 Pages) CUI INC – two hole options for longer component pins

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MODEL: HSS-B20-NP-04 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• round hole for component attachment
• two hole options for longer component pins
• black anodized finish
date 04/03/2017
page 1 of 3
MODEL
HSS-B20-NP-04
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
11.54
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
15.27
@ 1 W,
200 LFM
(°C/W)
3.76
@ 1 W,
400 LFM
(°C/W)
2.74
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
6.50
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0
0
0
0
1
15.27
3.76
2.74
2
27.05
7.51
5.43
3
38.74
11.26
8.23
4
48.62
15.04
11.17
5
59.41
18.81
13.89
6
69.24
22.56
16.83
7
79.43
26.28
19.71
8
88.27
30.18
22.48
9
95.85
33.95
25.41
10
104.56
37.87
28.29
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
100
Without Airflow
90
200 LFM
80
400 LFM
70
60
50
40
30
20
10
0
0
1
2
3
4
5
6
7
8
9
10
Dissipated Power (W)
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