HSS-B20-NP-01 Datasheet, PDF (1/3 Pages) CUI INC – low profile design

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MODEL: HSS-B20-NP-01 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• round hole for component attachment
• low profile design
• black anodized finish
date 03/29/2017
page 1 of 3
MODEL
HSS-B20-NP-01
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
18.29
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
21.92
@ 1 W,
200 LFM
(°C/W)
7.05
@ 1 W,
400 LFM
(°C/W)
5.56
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
4.10
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0
0
0
0
1
21.92
7.05
5.56
2
41.78
14.01
11.07
3
58.69
21.06
16.38
4
73.87
28.48
22.02
5
90.68
35.84
27.40
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
50
40
30
20
10
0
0
1
2
3
4
5
Dissipated Power (W)
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