HSS-B20-085H Datasheet, PDF (1/3 Pages) CUI INC – solder pin for secure PCB mounting

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MODEL: HSS-B20-085H │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• round hole for component attachment
• solder pin for secure PCB mounting
• black anodized finish
date 03/30/2017
page 1 of 3
MODEL
HSS-B20-085H
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
22.06
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
26.05
@ 1 W,
200 LFM
(°C/W)
7.46
@ 1 W,
400 LFM
(°C/W)
5.20
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
3.40
100
Power
(W)
0
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Natural
Conv.
200 LFM 400 LFM
0
0
0
90
Without Airflow
200 LFM
80
400 LFM
70
60
1
26.05
7.46
5.20
50
2
48.51
14.24
10.69
40
3
68.48
21.48
16.04
4
86.75
28.25
21.52
5
104.54
35.39
27.11
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
30
20
10
0
0
1
2
3
4
5
Dissipated Power (W)
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