HSS-B20-07 Datasheet, PDF (1/3 Pages) CUI INC – slide in style for easy component attachment

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SERIES: HSS-B20-07 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• available with and without solder pin
• slide in style for easy component attachment
• black anodized finish
date 03/29/2017
page 1 of 3
MODEL
solder pin
orientation
length
(mm)
HSS-B20-061H-02
horizontal
6.1
HSS-B20-0953H-02
horizontal
9.53
HSS-B20-065V-02
vertical
6.5
HSS-B20-NP-10
no pin
--
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
25.92
25.92
25.92
25.92
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
30.86
30.86
30.86
30.86
@ 1 W,
200 LFM
(°C/W)
7.24
7.24
7.24
7.24
@ 1 W,
400 LFM
(°C/W)
6.25
6.25
6.25
6.25
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
2.89
2.89
2.89
2.89
100
Power
(W)
0
1
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Natural
Conv.
200 LFM 400 LFM
0
0
0
30.86
7.24
6.25
90
Without Airflow
200 LFM
80
400 LFM
70
60
50
2
55.34
14.06
11.16
40
3
75.79
21.12
16.22
30
4
95.80
28.34
21.52
5
109.77
35.58
26.70
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
20
10
0
0
1
2
3
4
5
Heat Dissipated (W)
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