HSS-B20-0635 Datasheet, PDF (1/4 Pages) CUI INC – solder pin for secure PCB mounting

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SERIES: HSS-B20-0635 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• solder pin for secure PCB mounting
• round hole for component attachment
• black anodized finish
date 03/29/2017
page 1 of 4
MODEL
fin height
(mm)
HSS-B20-0635H
6.35
HSS-B20-0635H-01
9.53
HSS-B20-0635H-02
12.70
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
HSS-B20-0635H
@ 75°C ΔT,
nat conv
(°C/W)
28.85
27.78
29.09
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
35.46
33.93
33.89
@ 1 W,
200 LFM
(°C/W)
10.68
9.51
10.49
@ 1 W,
400 LFM
(°C/W)
7.88
6.84
6.81
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
2.60
2.70
2.58
100
Power
(W)
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Natural
Conv.
200 LFM 400 LFM
90
Without Airflow
200 LFM
80
400 LFM
70
0
0
0
0
60
1
35.46
10.68
7.88
2
59.42
20.81
15.77
3
83.82
31.59
23.83
4
101.40
41.80
31.52
5
122.52
52.02
38.83
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
50
40
30
20
10
0
0
1
2
3
4
5
Dissipated Power (W)
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