HSS-B20-061H-03 Datasheet, PDF (1/3 Pages) CUI INC – solder pin for secure PCB mounting

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MODEL: HSS-B20-061H-03 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• solder pin for secure PCB mounting
• black anodized finish
• aluminum
date 03/29/2017
page 1 of 3
MODEL
HSS-B20-061H-03
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
25.86
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
31.07
@ 1 W,
200 LFM
(°C/W)
5.72
@ 1 W,
400 LFM
(°C/W)
4.10
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
2.90
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0
0
0
0
1
31.07
5.72
4.10
2
54.97
12.61
8.99
3
77.04
19.56
14.04
4
95.24
27.21
19.43
5
110.74
34.70
24.50
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
50
40
30
20
10
0
0
1
2
3
4
5
Dissipated Power (W)
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