HSS-B20-05H Datasheet, PDF (1/3 Pages) CUI INC – round hole component attachment

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MODEL: HSS-B20-05H │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• round hole component attachment
• solder pins for secure PCB mounting
• black anodized finish
date 04/03/2017
page 1 of 3
MODEL
HSS-B20-05H
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
7.65
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
9.28
@ 1 W,
200 LFM
(°C/W)
2.01
@ 1 W,
400 LFM
(°C/W)
1.71
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
9.80
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0
0
0
0
1
9.28
2.01
1.71
2
18.40
4.86
3.36
3
26.40
7.67
5.49
4
34.76
10.40
7.93
5
42.69
13.54
10.18
6
51.31
16.36
12.60
7
58.97
19.19
14.87
8
65.64
22.01
17.14
9
70.68
24.88
19.38
10
76.52
27.89
21.89
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
100
Without Airflow
90
200 LFM
80
400 LFM
70
60
50
40
30
20
10
0
0
1
2
3
4
5
6
7
8
9
10
Heat Dissipated ( W )
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