HSS-B20-053H-01 Datasheet, PDF (1/3 Pages) CUI INC – round hole for component attachment

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MODEL: HSS-B20-053H-01 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• round hole for component attachment
• solder pins for secure PCB mounting
• black anodized finish
date 03/31/2017
page 1 of 3
MODEL
HSS-B20-053H-01
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
15.79
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
20.27
@ 1 W,
200 LFM
(°C/W)
5.83
@ 1 W,
400 LFM
(°C/W)
4.22
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
4.75
Power
(W)
0
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Natural
Conv.
200 LFM 400 LFM
0
0
0
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
1
20.27
5.83
4.22
50
2
35.97
11.51
8.34
40
3
50.37
17.06
12.42
4
65.25
22.79
16.41
5
79.19
28.53
20.60
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
30
20
10
0
0
1
2
3
4
5
Heat Dissipated (W)
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