HSS-B20-0508H Datasheet, PDF (1/3 Pages) CUI INC – three tabs for stable PCB placement

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SERIES: HSS-B20-0508H │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• round or slot hole attachment options
• three tabs for stable PCB placement
• black anodized finish
date 03/29/2017
page 1 of 3
MODEL
mounting hole
type
size
(mm)
HSS-B20-0508H-01R
round
Ø3.81
HSS-B20-0508H-01S
slot
3.9 x 9.52
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
15.83
15.83
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
20.74
20.74
@ 1 W,
200 LFM
(°C/W)
5.87
5.87
@ 1 W,
400 LFM
(°C/W)
4.22
4.22
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
4.74
4.74
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0
0
0
0
1
20.74
5.87
4.22
2
37.04
11.20
8.21
3
51.71
16.65
12.28
4
65.89
22.18
16.35
5
78.28
27.93
20.51
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
50
40
30
20
10
0
0
1
2
3
4
5
Heat Dissipated (W)
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