HSS-B20-0508H-01 Datasheet, PDF (1/3 Pages) CUI INC – black anodized finish

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MODEL: HSS-B20-0508H-01 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• round hole for component attachment
• solder pins for secure PCB mounting
• black anodized finish
date 04/03/2017
page 1 of 3
MODEL
HSS-B20-0508H-01
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
10.14
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
12.99
@ 1 W,
200 LFM
(°C/W)
3.51
@ 1 W,
400 LFM
(°C/W)
3.10
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
7.40
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0
0
0
0
1
12.99
3.51
3.10
2
24.98
7.29
5.90
3
35.01
11.39
8.91
4
44.78
15.00
11.93
5
54.16
18.87
14.84
6
63.78
22.93
17.86
7
72.49
26.77
20.92
8
79.12
30.54
24.03
9
85.23
34.46
26.83
10
92.25
38.38
29.87
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
50
40
30
20
10
0
0
1
2
3
4
5
6
7
8
9
10
Heat Dissipated ( W )
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