HSS-B20-0503H Datasheet, PDF (1/3 Pages) CUI INC – black anodized finish

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MODEL: HSS-B20-0503H │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• round hole for component attachment
• solder pins for secure PCB mounting
• black anodized finish
date 03/31/2017
page 1 of 3
MODEL
HSS-B20-0503H
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
16.30
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
19.73
@ 1 W,
200 LFM
(°C/W)
5.44
@ 1 W,
400 LFM
(°C/W)
4.22
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
4.60
Power
(W)
0
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Natural
Conv.
200 LFM 400 LFM
0
0
0
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
1
19.73
5.44
4.22
50
2
37.51
11.67
8.80
40
3
51.61
18.00
13.39
4
66.98
24.70
18.04
5
80.49
30.86
22.95
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
30
20
10
0
0
1
2
3
4
5
Dissipated Power (W)
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