HSS-B20-04 Datasheet, PDF (1/3 Pages) CUI INC – available with and without solder pins

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SERIES: HSS-B20-04 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• available with and without solder pins
• slide in style for easy component attachment
• black anodized finish
date 03/29/2017
page 1 of 3
MODEL
solder pin
orientation
length
(mm)
HSS-B20-061H-01
horizontal
6.1
HSS-B20-0953H-01
horizontal
9.53
HSS-B20-NP-07
no pin
--
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
33.28
33.28
33.28
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
37.62
37.62
37.62
@ 1 W,
200 LFM
(°C/W)
11.04
11.04
11.04
@ 1 W,
400 LFM
(°C/W)
8.48
8.48
8.48
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
2.25
2.25
2.25
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0
0
0
0
1
37.62
11.04
8.48
2
67.10
22.01
16.80
3
94.67
32.92
24.82
4
116.45
43.78
32.98
5
135.00
55.12
41.47
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
100
90
80
70
60
50
40
30
20
Without Airflow
200 LFM
10
400 LFM
0
0
1
2
3
4
5
Heat Dissipated (W)
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