HSS-B20-02 Datasheet, PDF (1/3 Pages) CUI INC – HEAT SINK

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SERIES: HSS-B20-02 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• available with and without solder pins
• folded backfins for maximum cooling
• black anodized finish
date 03/29/2017
page 1 of 3
MODEL
solder pin
orientation
length
(mm)
HSS-B20-074H
horizontal
7.4
HSS-B20-097H
horizontal
9.7
HSS-B20-NP-02
no pin
--
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
20.59
20.59
20.59
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
27.22
27.22
27.22
@ 1 W,
200 LFM
(°C/W)
5.39
5.39
5.39
@ 1 W,
400 LFM
(°C/W)
4.51
4.51
4.51
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
3.64
3.64
3.64
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0
0
0
0
1
27.22
5.39
4.51
2
46.27
10.41
8.92
3
64.76
15.66
13.12
4
79.42
20.53
17.21
5
91.49
25.37
21.27
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
50
40
30
20
10
0
0
1
2
3
4
5
Heat Dissipated (W)
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