HSS-B20-01 Datasheet, PDF (1/3 Pages) CUI INC – slide in style for easy component attachment

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SERIES: HSS-B20-01 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• available with and without solder pin
• slide in style for easy component attachment
• black anodized finish
date 03/29/2017
page 1 of 3
MODEL
solder pin
orientation
length
(mm)
HSS-B20-061H
horizontal
6.1
HSS-B20-0953H
horizontal
9.53
HSS-B20-065V
vertical
6.5
HSS-B20-NP
no pin
--
Note:
1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
@ 75°C ΔT,
nat conv
(°C/W)
18.63
18.63
18.63
18.63
thermal resistance¹
@ 1 W,
nat conv
(°C/W)
23.05
23.05
23.05
23.05
@ 1 W,
200 LFM
(°C/W)
5.01
5.01
5.01
5.01
@ 1 W,
400 LFM
(°C/W)
4.01
4.01
4.01
4.01
power
dissipation¹
@ 75°C ΔT,
nat conv
(W)
4.02
4.02
4.02
4.02
Power
(W)
0
1
2
3
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Natural
Conv.
200 LFM 400 LFM
0
0
0
23.05
5.01
4.01
42.19
9.68
7.89
57.90
14.39
11.64
100
90
Without Airflow
200 LFM
80
400 LFM
70
60
50
40
4
74.85
18.96
15.57
30
5
88.08
23.63
19.26
20
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
10
0
0
1
2
3
4
5
Heat Dissipated (W)
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