753_16 Datasheet, PDF (4/4 Pages) CTS Corporation – High Density Packaging

Series 753
Surface Mount Resistor Network
MECHANICAL SPECIFICATION
PACKAGE DRAWING
No. of Pads
"A" Dimension
SRT/DRT
mm
inch
08/16
6.22 ±0.12
0.245 ±0.005
09/18
6.86 ±0.12
0.270 ±0.005
10/20
7.49 ±0.12
0.295 ±0.005
12/24
8.76 ±0.12
0.345 ±0.005
Notes:
1. Pad termination (e3). Barrier plating is nickel (Ni) over silver (Ag) thick film pad with Matte tin (Sn) finish.
2. Reflow conditions per JEDEC-J-STD-020, +260°C maximum.
3. MSL = 1.
Dimension
B
C
D
E
F
G
H
mm
2.41 ±0.12
2.03 ±0.12
0.64 ±0.12
0.71 ±0.12
0.33 ±0.13
0.08 ±0.14
0.89 Ref.
inch
0.095 ±0.005
0.080 ±0.005
0.025 ±0.005
0.028 ±0.005
0.013 ±0.003
0.003 ±0.002
0.035 Ref.
RECOMMENDED LAND PATTERN
Dimension
753
mm
in.
Recommended Land Pattern
D
P
L
W
1.27
0.64
3.05
0.43
0.05 0.025 0.12 0.017
SRT Solder Paste Stencil Opening
Dimension
K
Sw
A
4 mil
mm
in.
2.75
0.108
0.30
0.012
NA
6 mil
mm
in.
1.72
0.068
0.30
0.012
NA
Q
0.15
0.006
0.15
0.006
J
S
0.89
0.51
0.035 0.02
DRT Solder Paste Stencil Opening
Dimension
K
Sw
A
4 mil
mm
in.
0.51
0.30
1.32
0.02 0.012 0.052
6 mil
mm
0.28
0.30
1.47
in.
0.011 0.012 0.058
Q
0.15
0.006
0.15
0.006
Document No. 008-0352-0
Page 4 - 4
Rev. B