Z3A52SBSBNL Datasheet, PDF (17/24 Pages) CTS Corporation – ADHESIVE PEEL AND STICK HEAT SINKS

SPECIFICATIONS
To Lock
Unlocked,
Zero-Insertion Force
(ZIF)
Position
Housing
Cam Shaft
To Unlock
Spring
Circuit Board or
Thermal Management
Frame
Cold Wall or
Mounting Surface
ZIF OPERATION
Locked, Maximum
Clamping Force
Position
CIRCUIT CARD
ASSEMBLY
COLDWALL
CTS®
MAX. PCB
INSERTION
COLDWALL CONFIGURATION
.240”
6.096mm
.3125”
7.938mm
.250”
6.35mm
.036”
.914mm
Fig. 1
(Pin Drive)
.125”
3.175mm ^3/16
Fig. 2
(Screwdriver Slot Drive)
Visual Identification Slot
.250”
6.35mm
.150”
3.81mm
Fig. 3
(Hexhead Drive)
ROD STYLES
Cooling area can be
forced air, liquid or
natural convection.
Finned areas can be
machined in where
necessary.
MIN. ZIF TO
HEAT SINK
.370”
9.398mm
THERMAL IMPEDANCE:
Board to sink: 1.28°C-Inch/Watt
MINIMUM PCB SPACING (inches):
Center to center: .375” + PCB thickness
MINIMUM BOARD THICKNESS:
.050”
ORDERING INFORMATION
Machined ZIF Enclosures are custom designed to Applications Engineering Department in Burbank,
meet customer specifications. Please contact CTS California for technical assistance.
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