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BDN21-3CB-A01 Datasheet, PDF (1/1 Pages) CTS Corporation – Adhesive peel and stick heat sinks
CTS®
W±0.01
With pre-applied adhesive, just peel
off the release liner and press onto the
component
Reduces assembly costs; no more
messy adhesives or greases required
Excellent mechanical bond
Thermally optimized pin fin
Omnidirectional
Adhesive shear strength at 100°C is
36psi (a one inch square heat sink would
require a 36lb. force to remove heat sink)
Applicable for BGA, PGA, PLCC,
and QFP packages
H±0.015
L±0.01
G±0.01
P±0.01
T±0.01
PART NUMBER***
(W)
SIZE
(L)
(H) T
BDN09-3CB/A01
BDN09-6CB/A01
0.91 0.91 .355 .09
.605 .10
BDN10-3CB/A01
BDN10-5CB/A01
1.01 1.01 .355 .09
.555 .10
BDN11-3CB/A01
BDN11-6CB/A01
1.11 1.11 .355 .09
.605 .10
BDN12-3CB/A01
BDN12-5CB/A01
1.21 1.21 .355 .09
.555 .10
BDN13-3CB/A01
BDN13-5CB/A01
1.31 1.31 .355 .09
.555 .10
BDN14-3CB/A01
1.41 1.41 .355 .09
NOTES:
BDN14-6CB/A01
.605 .10
*Thermal resistance BDN15-3CB/A01
1.51 1.51 .355 .09
of adhesive tape is BDN15-5CB/A01
.555 .10
included.
**Thermal resistance
values based on
BDN16-3CB/A01
BDN16-6CB/A01
1.61 1.61 .355 .09
.605 .10
power density of
BDN17-3CB/A01
1.71 1.71 .355 .09
3 watts/in2
***Part numbers
listed for standard
BDN18-3CB/A01
BDN18-6CB/A01
1.81 1.81 .355 .09
.605 .10
black anodized
BDN19-3CB/A01
1.91 1.91 .355 .09
heat sinks with
CTS adhesive
BDN21-3CB/A01
2.11 2.11 .355 .09
tapes.
All dimensions are in inches.
6
PIN FIN CONFIGURATION
THERMAL RESISTANCE CASE
TO AMBIENT* °C/WATTS
P
G
FIN
MATRIX
NATURAL
CONVECTION**
FORCED
CONVECTION
@ 400 LFPM
.069 .072
7x7
26.9
9.6
.132 .128
4x4
24.5
7.7
.083 .072
7x7
26.4
8.0
.111 .114
5x5
20.8
6.3
.076 .072
8x8
20.9
7.2
.119 .128
5x5
18.5
5.7
.060 .081
9x9
19.6
6.8
.105 .114
6x6
16.5
5.2
.074 .081
9x9
16.1
6.0
.125 .114
6x6
14.9
4.7
.067 .081 10x10
16.2
5.6
.128 .128
6x6
13.1
4.2
.062 .081 11x11
15.1
4.5
.118 .114
7x7
11.9
3.8
.072 .081 11x11
13.5
4.5
.119 .128
7x7
10.6
3.5
.065 .072 13x13
11.5
3.8
.072 .072 13x13
10.8
3.5
.128 .114
8x8
8.1
2.8
.069 .072 14x14
9.9
2.9
.064 .072 16x16
8.5
2.6