CT4148WSP Datasheet, PDF (5/5 Pages) Compact Technology Corp. – Small cignal chip diode

CT4148WSP
Suggested
thermal profiles for soldering
processes
280
260
240
220
200
180
160
140
120
Peak
Max dwell
time 4 sec
100
80
60
Soak
Max gradient
2 ^o C/s
Cool down
Max gradient
-4 ^oC/s
40
Preheat
20 Max gradient
2 ^o C/s
30
60
90
120
150
180
210
240
270
300
Time (seconds)
Fig.1 Typical Wave Soldering
Thermal Profile
330
360
240
220
200
180
160
140
120
100
80
60
40
20
Peak soldering
temperature
210 - 235 ^o C for standard
devices
235 - 255 ^o C for Pb-free
devices
Soak
Max time 2 min
Reflow
Max time
85 sec
Cool down
Max gradient -4 ^oC/s
Preheat
Max time 4 min.
Max gradient 2.5 ^oC/s
30
60
90
120
150
180
210
240
270
300
Time (seconds)
Fig.2 Typical IR Reflow Soldering
Thermal Profile
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CT4148WSP