XP-C Datasheet, PDF (8/16 Pages) Cree, Inc – Cree® XLamp® XP-C LEDs

XLAMP XP-C LEDS
THERMAL_TD_hES_eIG_rmN _{al Design}
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is
crucial for the end prod₆u₀c₀t to be designed in a manner that minimizes the thermal resistance from the solder point to
ambient in order to optimize lamp life and optical characteristics.
XPC
White, Blue,
500
Royal Blue
600
400
500
300
Rj-a = 15°C/W
Rj-a = 20°C/W
Rj-a = 25°C/W
400
200
Rj-a = 30°C/W
Rj-a = 15°C/W
300
100
200
0
Rj-a = 20°C/W
Rj-a = 25°C/W
Rj-a = 30°C/W
100 ⁰
50
100
150
200
Ambient Temperature (ºC)
0
Relative ⁰Inte²n⁰ sity⁴⁰ vs.⁶⁰Cur⁸r⁰ent¹⁰(⁰Tj =¹²⁰25º¹C⁴⁰ ) ¹⁶⁰
Ambient Temperature (ºC)
Green
600
500
400
300
200
100
0
0
20
40
60
80
100
120
140
160
Ambient Temperature (ºC)
Rj-a = 25°C/W
Rj-a = 30°C/W
Rj-a = 35°C/W
Rj-a = 40°C/W
Copyright © 2008-2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
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