XP-E-HEW Datasheet, PDF (7/11 Pages) Cree, Inc – Cree® XLamp® XP-E High-Efficiency White LEDs

XLAMP XP-E HIGH-EFFICIENCY WHITE LEDS
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp XP-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Profile Feature
Average Ramp-Up Rate (Ts_max to Tp)
Preheat: Temperature Min (Ts_min)
Preheat: Temperature Max (Ts_max)
Preheat: Time (ts_min to ts_max)
Time Maintained Above: Temperature (T_L)
Time Maintained Above: Time (t_L)
Peak/Classification Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25°C to Peak Temperature
Lead-Based Solder
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
215°C
10-30 seconds
6°C/second max.
6 minutes max.
Lead-Free Solder
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260°C
20-40 seconds
6°C/second max
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
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