XPEBWT-L1-0000-00C51 Datasheet, PDF (5/12 Pages) Cree, Inc – Cree® XLamp® XP-E2 LEDs

xlamp xp-e2 leds
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is
crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to
ambient in order to optimize lamp life and optical characteristics.
1200
1000
800
600
Rj-a = 10°C/W
Rj-a = 15°C/W
400 _{Rj-a = 20°C/W}
Rj-a = 25°C/W
200
0
0
20
40
60
80
100
120
140
Ambient Temperature (ºC)
Relative Flux vs. Current (T_J = 85 °C)
Relative Intensity vs. Current (Tj = 85ºC)
250%
200%
150%
100%
50%
0%
0
100
200
300
400
500
600
700
800
900 1000
Forward Current (mA)
Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree^®, the Cree logo and XLamp^® are registered trademarks
of Cree, Inc.
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