CPW2-1200S050 Datasheet, PDF (3/3 Pages) Cree, Inc – Silicon Carbide Schottky Diode Chip

Chip Dimensions
A
Symbol
Dimension
mm
inch
A
8.23
0.324
B
D
B
4.02
0.158
C
7.41
0.292
D
3.22
0.127
C
Part Number
CPW2-1200S050B
Anode
Al
Cathode
NiV/Ag
Package
Sawn on Foil
Marking
Wafer # on Foil
The die-on-tape method of delivering these SiC die may be considered a means of temporary storage only. Due
to an increase in adhesion over time, die stored for an extended period may affix too strongly to the tape. These
die should be stored in a temperature-controlled, nitrogen dry box soon after receipt. Cree will further recommend
that all die be removed from tape to a waffle pack, to a similar storage medium, or used in production within 2 - 3
weeks of delivery to assure 100% release of all die without issues.
This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body
nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited
to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical
equipment, aircraft navigation or communication or control systems, air traffic control systems, or weapons systems.
Copyright © 2008-2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc.
3
CPW2-1200S050 Rev. B
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: [phone]
Fax: [phone]
www.cree.com/power