450TR5050M-S18000 Datasheet, PDF (2/5 Pages) Cree, Inc – High-Reliability Eutectic, Solder Paste or Preforms

Maximum Ratings at T_A = 25°C ^{Notes 1&3}
DC Forward Current ^{Note 4}
Peak Forward Current (1/10 duty cycle @ 1 kHz)
LED Junction Temperature
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge Threshold (HBM) ^{Note 2}
Electrostatic Discharge Classification (MIL-STD-883E) ^{Note 2}
CxxxTR5050M-Sxx000
200 mA
250 mA
150°C
5V
-40°C to +100°C
-40°C to +100°C
1000 V
Class 2
Typical Electrical/Optical Characteristics at T_A = 25°C, If = 120 mA ^{Note 3}
Part Number
Forward Voltage (V_f, V)
C450TR5050M-Sxx000
Min.
2.7
Typ.
3.3
Max.
3.5
Reverse Current
[I(Vr=5V), μA]
Max.
2
Full Width Half Max
(λ_D, nm)
Typ.
20
Mechanical Specifications
CxxxTR5050M-Sxx000
Description
Dimension
Tolerance
P-N Junction Area (μm)
426 x 443
±35
Chip Area (μm)
500 x 500
±35
Chip Thickness (μm)
175
±15
Au Bond Pad Diameter Anode (μm)
90
±10
Au Bond Pad Thicknesses (μm)
1.0
±0.5
Au Bond Pad Diamater Cathode (μm)
98
±10
Bottom Contact Metal (um)
Bottom Area (μm)
Max If (mA)
200
Max Vf @Max If (V)
3.5
288 x 288
320 x 320
±25
±45
Bottom Contact Metal Thickness (μm)
Max Tj (Deg C)
150
3.0
±1.0
Max Power (W)
0.7
Notes:
1. Maximum ratings are pacTkhageerm-daelpRenedseinst.anTchee (aCb/oWv)e ratings 1w0ere determined 2u0sing lamps in c3h0ip-on-MCPCB (metal core PCB) packages for
characterization. Ratings for other packages may differ. Junction temperature should be characterized in a specific package to determine limitations.
Assembly processing temperature m_Iu_{f @}st _Tn_ao_mt _bexceed 325°C (<_R5_ths₍e_j-Ac₎o₌nds).
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2. Product resistance to electrostatic disch₂a₀r₀ge (ESD) according to t₂h₅e HBM is measur₂e₅d by simulating E₂S₅D using a rapid avalanche energy test (RAET).
The RAET procedures are designed to a₂p₀p₀roximate the maximu₁m₄₃ESD ratings sho₁w₃n₆.
129
3. All products conform to the listed minimu₀m and maximum specif₁ic₅a₀tions for electric₁a₅l₀and optical cha₁ra₅c₀teristics when assembled and operated at 120
mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are within the range of average values
expected by manufacturer in large quantities and are provided for information only. All measurements were made using lamps in T-1 3/4 packages
(with Hysol OS4000 epoxy encapsulant and clear epoxy die attach). Optical characteristics measured in an integrating sphere using Illuminance E.
4. The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end-product to be
designed in a manner that minimizes the thermal resistance from the LED junction to ambient in order to optimize product performance.
250
200
150
Rth _j-a = 10 C/W
Rth _j-a = 20 C/W
100
Rth _j-a = 30 C/W
Rth _j-a = 40 C/W
50
0
50
75
100
125
150
175
Ambient Temperature (C)
Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks, and TM and TR5050M are trademarks of Cree, Inc.
2
CPR3EX Rev. -
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: [phone]
www.cree.com