XRCWHT-L1-0000-00501 Datasheet, PDF (10/16 Pages) Cree, Inc – XLamp XR-C LEDs

XLamp xr-c leds
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. Given
an existing thermal resistance of 12 °C/W or 15 °C/W between the junction and the solder point, it is crucial for the end
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to
optimize lamp life and optic_W^Ta_h^hl_ite^ec_, h_R^r_oa^m_yr_ala^a_Bc_l^l_ut_ee^D_, r_B^ei_lus_e^st_&iⁱc^g_Gs_rⁿ._een
600
500
White
Royal Blue
Blue
Green
400
300
Rj-a = 15°C/W
200
Rj-a = 25°C/W
Rj-a = 35°C/W
100
0
0
Amber
400
25
50
75
100
125
150
ambient temperature (°c)
Amber
300
200
Rj-a = 20°C/W
Rj-a = 30°C/W
100
Rj-a = 40°C/W
0
0
25
Red-Orange, Red
50
75
100
125
150
ambient temperature (°c)
800
700
600
Red-Orange
Red
500
400
Rj-a = 20°C/W
300
Rj-a = 30°C/W
Rj-a = 40°C/W
200
100
0
0
25
50
75
100
125
150
ambient temperature (°c)
Copyright © 2007-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree^®, the Cree logo and XLamp^® are registered
trademarks of Cree, Inc.
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