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SLV6A-FKB Datasheet, PDF (10/11 Pages) Cree, Inc – PLCC6 3 in 1 SMD LED
REFLOW SOLDERING
• The SLV6A-FKB is rated as a MSL 5a product.
• The recommended floor life out of bag is 24hrs.
• The best practices suggestion is to bake 24-hour/80ºC before use.
• The temperature profile is as below.
Melting-point
Cree PLCC6 3 in 1 SMD LED
SLV6A-FKB
Document No.: COTCO-05-0057
Rev. NO. : 13
Pre-heat
Soak
Reflow
Cooling
Time
U se al lSMD b esi des LP6-NP P1- 01-N1
Use oSnolyldwerit=h SSnL6V36-AP-bF3K7B
SoldSeorld=eLrinegadp-afrde:e
Average ramp-up rate = S4oºCld/esrmax.
AveraPgererhameapt-utepmrapteer=at4uºrCe/s=m1a0x0ºC ~150ºC
Preheat temperature = 150ºC ~200ºC
Preheat time = 100s max.
Preheat time = 120s max
RampR-daomwnp-rdatoew=n6rºaCte/s=m6axºC/s max.
Average ramp-up rate = 4ºC/s max
Preheat temperature = 150ºC ~22.700ºC
Preheat time = 100s max.
Ramp-down rate = 6ºC/s max.
Peak tPeemapkertaetmurpee=ra2t3u5rºeC=m2a3x0ºC max.
Peak temperature = 250ºC max.
Time Twiimthien w5ºitChoinf a5cºtCuaol fPeaacktuTaeml PpeeraaktuTreem= p1e0sramtuarxe = 10s max.
Time within 5ºC of actual Peak Temperature = 10s max.
DuratDionuraabtoiovne 2a1b7oºvCeis14853sºCmaisx 80s max.
Duration above 217ºC is 80s max.
Only use LP6-NPP1-01-N1 [13]
Solder = Low Lead-free
Average ramp-up rate = 3ºC/s max.
8.2
Preheat temperature = 130ºC ~170ºC
Preheat time = 120s max.
Ramp-down rate = 6ºC/s max.
Peak temperature = 213ºC max.
Time within 3ºC of actual Peak Temperature = 25s max.
Duration above 200ºC is 40s max.
Recommended solder pad design for heat dissipation (2-pin SMD LED):
7.0
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
2.6 oCfopCyrerieg,hItn©c. 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc.
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