CLX6F-FKC Datasheet, PDF (10/11 Pages) Cree, Inc – Cree PLCC6 3 in 1 SMD LED

REFLOW SOLDERING
• The CLX6F-FKC is rated as a MSL 5a product.
• The recommended floor life out of bag is 24hrs.
• The best practices suggestion is to bake 24-hour/80ºC before use.
• The temperature profile is as below.
Melting-point
Cree PLCC6 3 in 1 SMD LED
CLX6F-FKC
Document No.: COTCO-05-0057
Rev. NO. : 13
Pre-heat
Soak
Reflow
Cooling
Time
_{U se al lSMD b esi des LP6-NP P1- 01-N1}
Use o_Sn_ol_ly_dew_rit₌h_SC_nL₆X_3-6_PF_b-₃F₇KC
Solder = Lead-free
Solder
Average ramp-up rate = 4ºC/s max.
Average ramp-up rate = 4ºC/s max
Average ramp-up rate = 4ºC/s max
Prehe^Pat^rete^hm^ep^ae^tr^ta^et^mure^pe=^ra1^t5^u0^rº^eC⁼~¹2⁰00⁰º^ºC^{C ~150ºC}
Preheat temperature = 150ºC ~200ºC
Prehe^Pat^reti^hm^ee^a=^{t t}1^im20^es ⁼m¹ax^{00s max.}
Preheat time = 100s max.
RampR-daomwnp-rdatoew=n6rºaCte/s=m6axºC/s max.
Ramp-down rate = 6ºC/s max.
Peak t_Pe_em_ap_ker_ta_et_mur_pe_e=_ra2_t5_u0_rº_eC₌m₂a₃x_{0ºC max.}
Time _Tw_ii_mthi_en _w5º_itC_ho_inf a₅c_ºt_Cua_ol _fPe_aa_ck_tuT_aem_{l P}pe_er_aa_ktu_Tre_em= _p1_e0s_ram_tua_rx_{e = 10s max.}
Duration above
Duration
2_a1_b7_oº_vC_eis₁6₈0₃s_ºCma_isx
80s
max.
Peak temperature = 250ºC max.
Time within 5ºC of actual Peak Temperature = 10s max.
Duration above 217ºC is 80s max.
Only use LP6-NPP1-01-N1 ^[13]
Solder = Low Lead-free
Average ramp-up rate = 3ºC/s max.
Preheat temperature = 130ºC ~170ºC
Preheat time = 120s max.
Ramp-down rate = 6ºC/s max.
Peak temperature = 213ºC max.
Time within 3ºC of actual Peak Temperature = 25s max.
Duration above 200ºC is 40s max.
Recommended solder pad design for heat dissipation (2-pin SMD LED):
7.0
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
2.6 ^{oCfopCyrerieg,hItn©c. 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc.}
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