CLV6A-FKB Datasheet, PDF (10/11 Pages) Cree, Inc – PLCC6 3 in 1 SMD LED

Reflow Soldering
• The CLV6A-FKB is rated as a MSL 3 product.
• The recommended floor life out of bag is 24hrs.
• The best practices suggestion is to use the product as soon as possible when removDeodcfruommetnhet Nbaog.:. COTCO-05-0057
• The temperature (Top surface of SMD LED) profile is as below:
Rev. NO. : 13
Melting-point
Pre-heat
Soak
Reflow
Cooling
Time
^{Us e al lSM Dbesi desLP6- N PP 1- 01- N 1}
Us^Se^oo^ldn^ely^{r =}wi^Sthⁿ⁶C³L^-PV^b6³A⁷-FKB
Solder _S=_oL_lde_ea_rd_in-_gfre_pe_ad:
2.7
Average ramp-up ra^St^oe^ld=^e4^r º⁼C^L/s^owma^Lex.^ad-Free
Average ramp-up rate = 4ºC/s max
Av_Pe_rr_eag_he_eara_tm_tep_m-u_pp_er_ra_ate_tu=_re4₌ºC₁/s₀₀m_ºa_Cx _~150ºC
Preheat temperature = 150ºC ~200ºC
Preheat time = 100s max.
Preheat time = 120s max
Ramp-down rate = 6ºC/s max.
Ramp-down rate = 6ºC/s max
Pe^Pa^ek^ate^km^tep^mera^pt^eu^rr^ae^t=^ur2^e3⁼5º²C³m^0ºa^Cx ^max.
Tim^Tie^mw^eit^whiⁱn^th5ⁱⁿºC⁵o^ºf^Cac^ot^fua^al^cP^tuea^ak^{l P}Te^em^ap^ke^Tra^etu^mre^pe=^ra1^t0^us^rema⁼x^{10s max.}
DuDrautriaontioanboavbeo2v1e7º1C83isº4C5sism8a0xs max.
Preheat temperature = 150ºC ~200ºC
Preheat time = 100s max.
Ramp-down rate = 6ºC/s max.
Peak temperature = 250ºC max.
Time within 5ºC of actual Peak Temperature = 10s max.
Duration above 217ºC is 80s max.
Only use LP6-NPP1-01-N1 ^[13]
8.2
Solder = Low Lead-free
Average ramp-up rate = 3ºC/s max.
Preheat temperature = 130ºC ~170ºC
Preheat time = 120s max.
Ramp-down rate = 6ºC/s max.
Peak temperature = 213ºC max.
Time within 3ºC of actual Peak Temperature = 25s max.
Duration above 200ºC is 40s max.
Recommended solder pad design for heat dissipation (2-pin SMD LED):
7.0
2.6
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and
the Cree logo are registered trademarks of Cree, Inc.
10
CLD-CT1163.002
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: [phone]
Fax: [phone]
www.cree.com/ledlamps