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XTEAWT-00-0000-000000F51 Datasheet, PDF (1/17 Pages) Cree, Inc – XLamp XT-E LEDs
Product family data sheet
Cree® XLamp® XT-E LEDs
Product Description
XLamp® XT-E is Cree’s highest
performing silicon carbide-based
LED technology, delivered in
Cree’s industry-standard XP/XT
packaging. XT-E White sets the
new standard for high performance
and dramatically lowers system
cost. XT-E Royal Blue is Cree’s
highest performing source of royal
blue light for remote‑phosphor
applications.
Cree XLamp LEDs bring high
performance
and
quality
of light to a wide range of
lighting applications, including
remote‑phosphor, color‑changing,
portable and personal, outdoor,
indoor‑directional, transportation,
stage and studio, commercial and
emergency‑vehicle lighting.
FEATURES
• Available in white, 80-CRI min
white, 70-CRI min white and
royal blue
• Warm white available in 85- and
90-CRI min.
• New: available in 2200 K CCT
• Binned at 85 °C
• Cool white efficacy of up to
148 lm/W (@ 85 °C, 350 mA)
• Royal Blue wall plug efficiency of
up to 53% (@ 85 °C, 350 mA)
• Wide viewing angle: 115-140°
• Thermal resistance: 5 °C/W
• Maximum drive current: 1.5 A
• Electrically neutral thermal path
• Vf binning supported for XT-E
White and Royal Blue
• XT-E Royal Blue sorted into
2.5‑nm wavelength bins
• Unlimited floor life at
≤ 30 ºC/85% RH
• Reflow solderable - JEDEC
J‑STD‑020C compatible
• RoHS- and REACh‑compliant
• UL‑recognized component
(E349212)
Table of contents
Characteristics........................... 2
Flux Characteristics..................... 3
Relative Spectral Power
Distribution............................... 5
Relative Luminous Flux vs.
Junction Temperature.................. 6
Relative Radiant Flux vs.
Junction Temperature.................. 6
Electrical Characteristics.............. 7
Relative Luminous Flux vs.
Current..................................... 8
Relative Radiant Flux vs. Current.. 8
Relative Chromaticity vs. Current
and Temperature........................ 9
Typical Spatial Distribution..........10
Thermal Design.........................11
Reflow Soldering Characteristics..12
Notes.......................................13
Mechanical Dimensions..............14
Tape and Reel...........................15
Packaging.................................16
NOTE: For remote phosphor applications, a separate license to certain Cree patents is required.
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.
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Cree, Inc.
4600 SiliCcroene,DIrnivce.
D4u6rh0a0mS,iliNcoCn2D77ri0v3e
USA TelD: u+r1h.a9m19, .N3C132.5737003
USA Twewl:w+.c1r.e9e1.9c.o3m13/x.5la3m00p