XREWHT-L1-0000-00601 Datasheet, PDF (1/12 Pages) Cree, Inc – XLamp® XR-E LED

Cree^® XLamp^® XR-E LED
Data Sheet
Cree XLamp LEDs combine the brightness of power LED chips with a rugged
package capable of operating up to four watts. Cree XLamp LEDs lead the solid-
state lighting industry in brightness while providing a reflow-solderable design
that is optimized for ease of use and thermal management. Lighting applications
featuring XLamp LEDs maximize light output and increase design flexibility, while
minimizing environmental impact.
Cree XLamp LEDs bring lighting-class brightness and efficiency to a wide range of
lighting and backlighting applications, including portable lighting and flashlights,
outdoor and industrial, signaling, architectural, landscaping and entertainment/
advertising installations.
FEATURES
• Guaranteed minimum flux order codes up to
100 lm in white and 23.5 lm in blue
• Over 80 lm/W available in white
• Available in white (2,600 K to 10,000 K CCT),
blue and royal blue
• Drive currents: 350 to 1000 mA
• Industry’s lowest thermal resistance: 8°C/W
• Max junction temperature: 150°C
• Industry-leading JEDEC standard pre-
qualification testing
• Reflow solderable – JEDEC J-STD-020C
compatible
• Electrically neutral thermal path
• RoHS-compliant
• Lumen maintenance of greater than 70% after
50,000 hours
Table of Contents
Flux Characteristics (T_J = 25°C)................................................................................2
Characteristics.......................................................................................................... 3
Relative Spectral Power............................................................................................4
Photometric Output vs. Junction Temperature (I_F = 350 mA)...................................5
Electrical Characteristics (T_J = 25˚C)........................................................................6
Thermal Design.........................................................................................................6
Relative Intensity vs. Current (T_J = 25˚C)................................................................7
Typical Spatial Radiation Pattern..............................................................................7
Reflow Soldering Characteristics...............................................................................8
Notes........................................................................................................................ 9
Mechanical Dimensions (T_A = 25°C)........................................................................10
Tape and Reel.........................................................................................................11
Dry Packaging and Packaging.................................................................................12
Subject to change without notice.
www.cree.com/xlamp