XPGWHT-L1-0000-00E51 Datasheet, PDF (1/10 Pages) Cree, Inc – Cree® XLamp® XP-G LEDs

Cree^® XLamp^® XP-G LEDs
Data Sheet
The XLamp XP-G LED delivers unprecedented levels of light output and efficacy for a
single die LED. The XLamp XP-G LED continues Cree’s history of innovation in LEDs for
lighting applications with wide viewing angle, symmetrical package, unlimited floor life
and electrically neutral thermal path.
XLamp XP-G LEDs are the ideal choice for lighting applications where high light output
and maximum efficacy are required, such as LED light bulbs, outdoor lighting, portable
lighting, indoor lighting and solar-powered lighting.
FEATURES
• Available in white and outdoor white
• ANSI-compatible chromaticity bins
• Maximum drive current: 1500 mA
• Low thermal resistance: 6°C/W
• Wide viewing angle: 125°
• Unlimited floor life at ≤ 30ºC/85% RH
• Reflow solderable - JEDEC J-STD-020C
• Electrically neutral thermal path
• RoHS and REACH-compliant
• UL-recognized component (E326295)
Table of Contents
Flux Characteristics (T_J = 25°C)................................................................................................................. 2
Characteristics......................................................................................................................................... 2
Relative Spectral Power Distribution............................................................................................................ 3
Relative Flux vs. Junction Temperature (I_F = 350 mA)................................................................................... 3
Electrical Characteristics (T_J = 25°C)........................................................................................................... 4
Thermal Design........................................................................................................................................ 4
Relative Flux vs. Current (T_J = 25°C).......................................................................................................... 5
Typical Spatial Distribution........................................................................................................................ 5
Reflow Soldering Characteristics................................................................................................................. 6
Notes..................................................................................................................................................... 7
Mechanical Dimensions (T_A = 25°C)............................................................................................................ 8
Tape and Reel.......................................................................................................................................... 9
Packaging............................................................................................................................................. 10
Subject to change without notice.
www.cree.com/xlamp
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