CXXXXR230-SXX00-A Datasheet, PDF (1/4 Pages) Cree, Inc – XT™ Rectangular LEDs

XT^™ Rectangular LEDs
CxxxXR230-Sxx00-A
Cree’s XT Rectangular LEDs are the next generation of solid-state LEDs that combine highly efficient InGaN materials
with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED
chips have a geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single
wire bond connection. These vertically structured LED chips are approximately 150 microns in height and require a low
forward voltage. Cree’s XT Rectangular chips are tested for conformity to optical and electrical specifications and the
ability to withstand 1000 V ESD. Applications for XT Rectangular LEDs include next-generation mobile appliances for
use in their LCD backlights and digital camera flash where brightness, sub-miniaturization, and low power consumption
are required.
FEATURES
• XT Rectangular LED Performance
– 460 nm & 470 nm
 XR-18™ – 18.0 mW min.
 XR-21™ – 21.0 mW min.
• Thin 150 µm Chip
• Low Forward Voltage – 3.2 Typical at 20 mA
• Single Wire Bond Structure
• Class 2 ESD Rating
APPLICATIONS
• Mobile Appliance LCD Backlighting
• Digital Camera Flash
CxxxXR230-Sxx00-A Chip Diagram
Top View
G•SiC LED Chip
230 x 380 μm
Gold Bond Pad
105 μm Diameter
Bottom View
Backside
Metalization
Die Cross Section
Cathode (-)
SiC Substrate
t = 150 µm
Anode (+)
Subject to change without notice.
www.cree.com