CXXXEZ700-SXX000 Datasheet, PDF (1/6 Pages) Cree, Inc – Cree® EZ700™ LED

Cree^® EZ700™ LED
Data Sheet
CxxxEZ700-Sxx000
Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials
with Cree’s proprietary optical design and device technology to deliver superior value for high-intensity LEDs. The
optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. Additionally, these
LEDs are die attachable with conductive epoxy, solder paste or solder preforms, in addition to using the flux eutectic
method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height. Cree’s
EZ™ chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000 V ESD.
These LEDs are useful in a broad range of applications, such as general illumination, automotive lighting and LCD
backlighting.
FEATURES
• EZBright Power Chip LED Rf Performance
– 200 mW min. & 260 mW min. – 450 nm
– 180 mW min. & 240 mW min. – 460 nm
– 160 mW min. & 220 mW min. – 470 nm
• Lambertian Radiation
• Conductive Epoxy, Solder Paste or Preforms,
or Flux Eutectic Attach
• Thin 100 μm Chip
• Low Forward Voltage – 3.6 V Typical at 350 mA
• Single Wire Bond Structure
• 1000 V ESD Threshold Rating
APPLICATIONS
• General Illumination
– Aircraft
– Decorative Lighting
– Task Lighting
– Outdoor Illumination
• White LEDs
• Crosswalk Signals
• Backlighting
• Automotive
CxxxEZ700-Sxx000 Chip Diagram
Top View
EZBright LED Chip
680 x 680 μm
Backside
Metallization
Gold Bond Pad
130 x 130 μm
Bottom View
t = 100 μm
Subject to change without notice.
www.cree.com
Die Cross Section
Cathode (-)
Anode (+);
3 μm AuSn