CXXXEZ1000-SXX000 Datasheet, PDF (1/6 Pages) Cree, Inc – Cree® EZ1000™ LEDs

Cree^® EZ1000™ LEDs
Data Sheet
CxxxEZ1000-Sxx000
Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN
materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-
intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern.
Additionally, these LEDs are die-attachable with conductive epoxy, solder paste or solder preforms, as well as the flux
eutectic method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height.
Cree’s EZ™ chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad
range of applications such as general illumination, automotive lighting, and LCD backlighting.
FEATURES
APPLICATIONS
• EZBright LED Technology
• General Illumination
– 200 mW min. - 450, 460 & 470 nm
– Aircraft
– 300 mW min. - 450, 460 & 470 nm
– Decorative Lighting
– 80 mW min. - 527 nm
– Task Lighting
– 130 mW min. - 527 nm
– Outdoor Illumination
• Lambertian Radiation
• White LEDs
• Conductive Epoxy, Solder Paste or Preforms, or Flux • LCD Backlighting
Eutectic Attach
• Projection Displays
• Thin 100 μm Chip
• Automotive
• Low Forward Voltage
CxxxEZ1000-Sxx000 Chip Diagram
Top View
EZBright LED
980 x 980 μm²
Bottom View
Die Cross Section
130 x 130 μm²
Gold Bond Pads (2)
Backside Metalization
t = 100 μm
Cathodes (-)
Anode (+)
3 μm AuSn
Subject to change without notice.

www.cree.com